Precautions for using FPC flexible circuit boards
Release time:
2023-03-29
Source:
The design of FPC flexible circuit boards is simple, small in size, and can be directly connected, which has great potential for development in the electronic product market. Among them, FPC flexible circuit boards are widely used in mobile phones, and have a high compatibility with mobile phone batteries, displays, touch screens, and cameras. They are mainly composed of double-sided boards and rigid flexible combination boards. Their lightweight and short advantages save a lot of space for the interior of mobile phones. The traditional connection methods either have complex circuits or special electrical requirements, and also require processing of many signals, which is very inconvenient to apply. With FPC flexible circuit boards, the internal connection lines of mobile phones can be greatly simplified, achieving stable electrical transmission.
Precautions for using FPC flexible circuit boards:
1. FPC flexible circuit boards will undergo surface coating treatment to effectively prevent oxidation. There are certain environmental requirements for storage, with temperature controlled below 25 ° C and humidity controlled within the range of 50% -70%.
2. FPC flexible circuit boards have strong bending resistance, but the conductor part is not suitable for bending and cannot be bent directly on the through hole. During the assembly process of FPC ink type protective layer, bending above 90 ° C is strictly prohibited, and bending at 180 ° C is not allowed, which may cause problems such as wire breakage.
3. Areas where stress is concentrated on FPC flexible circuit boards, such as covering films, metal finger ends, and external corners, are prone to line breakage during assembly. Therefore, special attention should be paid when using them.
Performance indicators of FPC flexible circuit board:
The performance content of FPC flexible circuit board mainly includes: copper foil adhesion, solderability of solder pads, roundness of solder pads, screen clarity, surface smoothness, circuit connectivity, insulation performance, and so on. It is necessary to conduct comprehensive verification on the appearance, material, and performance of FPC flexible circuit boards.
Copper foil adhesion refers to the adhesion between FPC wires and the substrate. Copper foil adhesion is small, and FPC wires are easy to peel off from the solder pad substrate, so it needs to be verified. Apply transparent adhesive to the required FPC wire, remove bubbles, and quickly pull it off in a 90 ° direction. If the wire is intact, verify that the copper foil adhesion of the FPC flexible circuit board is qualified.
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